OAI 6000 FSA 全自動(dòng)上側(cè)或后側(cè)光刻機(jī)

OAI 6000 FSA 全自動(dòng)上側(cè)或后側(cè)光刻機(jī)

詳細(xì)介紹

型號(hào)6000 FSA用于生產(chǎn)的全自動(dòng)，上側(cè)或后側(cè)光刻機(jī)

用于：半導(dǎo)體，MEMS，傳感器，微流體，IOT，包裝
憑借在半導(dǎo)體行業(yè)40多年的制造，OAI滿足了一個(gè)新的精英階段的生產(chǎn)光刻設(shè)備的動(dòng)態(tài)市場的日益增長的挑戰(zhàn)。

建立在著名的OAI模塊化平臺(tái)上，6000系列具有*自動(dòng)化的亞微米分辨率的頂側(cè)或背側(cè)對齊，提供的性價(jià)比。

對準(zhǔn)器具有*的光束光學(xué)，在掩模模式下具有優(yōu)于±3％的均勻性和每小時(shí)180個(gè)晶片的吞吐量，這導(dǎo)致更高的產(chǎn)量。 6000系列可以處理厚和粘合基板（高達(dá)7000微米），翹曲晶片（高達(dá)7 mm-10mm），薄基板（低至100微米厚）和厚光致抗蝕劑的各種晶片。

具有的工藝重復(fù)性，6000系列是所有生產(chǎn)環(huán)境的解決方案。選擇頂部或可選的背面對齊，使用OAI的基于Cognex的自定義模式識(shí)別軟件。對于總體光刻工藝，Series1 6000可以與集束工具無縫集成。 OAI的新生產(chǎn)面罩對齊器是總包。

好處

•全自動(dòng)
•側(cè)面對齊
•可選：底部對齊
UV到NUV
•集群工具集成
•自定義軟件


規(guī)格

曝光系統(tǒng)
曝光模式真空接觸硬接觸軟接觸接近（2μ間隙）
高級光束
均勻梁尺寸：50mm - 200mm方形/圓
200mm-300mm見方/圓
均勻度：優(yōu)于±3％
相機(jī)：雙攝像頭與CCTV擴(kuò)展的景深


對齊系統(tǒng)

模式識(shí)別CognexvisionPro¹™與OAI定制軟件
對準(zhǔn)精度0.5μ頂面
1.0μ，頂部到底部可選背面對齊
預(yù)對準(zhǔn)精度優(yōu)于±50μ
自動(dòng)對齊頂部到底部
頂部


晶片處理

基材尺寸50mm-200mm圓形或方形或200mm-300mm圓形或正方形
薄晶片低至100M
翹曲晶片高達(dá)7mm-10mm
厚和粘合基板高達(dá)7000μ
機(jī)器人單臂和雙臂晶片處理
失步補(bǔ)償標(biāo)準(zhǔn)軟件或可選的熱卡盤
晶片尺寸轉(zhuǎn)換5分鐘以內(nèi)
吞吐量掩模每小時(shí)180個(gè)晶片 - 隨后75-100個(gè)晶片每小時(shí)
楔形效果平整3點(diǎn)或可選非接觸

可用選項(xiàng)

IR自動(dòng)對齊，
盒式磁帶映射
365nm LED曝光光源
溫度控制晶片卡盤
集成屏蔽管理控制
用于全光刻的集成光刻集群
使用SMIF或FOUP接口模塊的過程環(huán)境控制
非接觸式調(diào)平
邊緣夾緊

Model 6000 FSA Fully Automated, Topside or Backside Mask Aligner for Production

For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

Built on the venerable OAI modular platform, the Series 6000 has topside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

The Aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.

With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either top side or optional back side alignment which uses OAI's customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI's new production mask Aligners are the total package.

BENEFITS

• Fully Automated
• Topside Alignment
• Optional: Bottomside Alignment
• DUV to NUV
• Cluster Tool Integration
• Customized Software
SPECIFICATIONS

Exposure System
Exposure Modes Vacuum contact Hard contact Soft contact Proximity (2μ gap)
Advanced Beam Optics
Uniform Beam Size: 50mm - 200mm square/round
200mm - 300 mm square/round
Uniformity: Better than ±3%
Camera: Dual Camera with CCTV with Expanded Depth of Field

Alignment System
Pattern Recognition Cognex visionPro¹™ with OAI customized software
Alignment Accuracy 0.5μ topside
1.0μ with top to bottom optional backside alignment
Pre-alignment Accuracy Better than ±50μ
Auto-alignment Top to bottomside

Topside

Wafer Handling
Substrate size 50mm – 200mm round or square or 200mm-300mm round or square
Thin wafers Down to 100Μ
Warped Wafers Up to 7mm-10mm
Thick & Bonded Substrates Up to 7000μ
Robotics Single and dual arm wafer handling
Run-out compensation Standard software or optional thermal chuck
Wafer size conversion 5 minutes or less
Throughput 1st mask 180 wafers per hour - subsequent 75-100 wafers per hour
Wedge Effect Leveling 3 point or optional non-contact
Available Options